A Revolutionary Surface Cleaning Solution at Pvateplaamerica.Com
In semiconductor manufacturing plasma ashing is the process of removing the light sensitive coating from an etched wafer. Using a plasma source, a monatomic substance known as a reactive species is generated. Oxygen or fluorine is the most common reactive species. The reactive species combines with the photo resist forming ash which is removed with a vacuum pump. These days, Plasma Cleaning system gives a gainful way out for the activation of component surfaces before extra processing. Plasma surface treatment advances wet ability and sticking of ink, adhesives and coatings on many different surfaces. Our Plasma Treatment equipment and products are cost-effective and trustworthy. This treatment is an economical solution for the cleaning before further processing. This is true for outlines with multifaceted surfaces that cannot be treated using usual radiance treatment devices. Plasma treatment is supportive treating with different materials’ surface such as metals, glas